Researchers led by Assoc. Prof. Dr. Savaş Taşoğlu from the Department of Mechanical Engineering at Koç University have developed a new, open-access and machine learning–assisted design tool aimed at ...

Siemens collaborates with TSMC to advance AI-powered automation across the semiconductor design workflow, including AI automated Design Rule Check (DRC) fixing flows and Fuse EDA AI system integration ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

To improve photonic and electronic circuitry used in semiconductor chips and fiber optic systems, researchers at the McKelvey School of Engineering at Washington University in St. Louis tinkered with ...

Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...

Today, the design of most monolithic SoCs follows a familiar pattern. Requirements definition leads to an architectural design. Then, the design team selects and qualifies the necessary IP blocks, ...

This is a sponsored article brought to you by Siemens. In the world of electronics, integrated circuits (IC) chips are the unseen powerhouse behind progress. Every leap—whether it’s smarter phones, ...

SAN FRANCISCO--(BUSINESS WIRE)--Ausdia, the leading provider of design constraints verification and management solutions, today introduced Timevision TM OneSource, at DAC 2025, the Chips to Systems ...

Can vibrations replace magnets in power chips? A design that uses piezoelectric resonators can improve efficiency in high ...