CINCINNATI--(BUSINESS WIRE)--Flexible packaging leader ProAmpac today joined with L’Oréal – Matrix Hair Care to celebrate acceptance of two Graphic Design USA (GDUSA) awards for “disruptive” consumer ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...