Arteris recently announced the expansion of its multi-die IP solution. The new upgrades to the company’s network-on-chip (NoC) IP library include the FlexNoC Network-on-Chip with CodaCache Last-Level ...

Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As ...

Precision metalforming processes involve complex and strong interactions between the workpiece (material and shape) and forming equipment, as well as lubrication, temperature, and other manufacturing ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The pressure to increase chip density has caused designers to leapfrog Moore’s Law and leverage other technologies beyond sheer feature size to address it. Since Gordon E. Moore, co-founder of Intel, ...

The first question design teams need to consider is what functional blocks and functions will be included in a design and how those functions will be partitioned into different chiplets. Additionally, ...