SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...

SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq ...

Siemens collaborates with TSMC to advance AI-powered automation across the semiconductor design workflow, including AI automated Design Rule Check (DRC) fixing flows and Fuse EDA AI system integration ...

MONTEREY, Calif. — Despite EDA vendor claims to the contrary, no supplier is today offering a complete IC implementation tool set, according to Gary Smith, chief EDA analyst at Gartner Dataquest. In a ...

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Siemens is collaborating with TSMC to advance AI-powered automation across EDA workflows using the recently launched Fuse EDA AI System, a domain-scoped agentic AI system.

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...

Expanding partnership enables Cadence’s Design for AI and AI for Design strategy across TSMC’s N3, N2, A16 and A14 process nodes​. Developing “agent‑ready” digital and ...

PITTSBURGH, Oct. 26, 2022 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ ...