The micro/nano metal pattern formation is a key step in the assembly of various devices. However, ex situ approaches of metal patterning limited their industrial applications due to the poor stability ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

Metal facade cladding systems by Kasso aim to meet both the functional and aesthetical requirements of a construction project. They can be used both for a new construction or for a renovation of an ...

Pouring molten metal into three-dimensional molds to make metal parts is the basis behind both sand and investment casting. But there are significant differences between these two methods. In sand ...