Kyocera America, Inc. announced on F3b. 7 that it has doubled its flip-chip assembly capacity for microelectronic devices with a new $3.5 million Class 10,000 clean room, offering lead-free processes ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...